Testmethodsforelectricalmaterials,printedboardsandotherinterconnectionstructuresandassemblies—Part5-3:Generaltestmethodsformaterialsandassemblies—Solderingpasteforprintedboardassemblies
Electrostatics—Part5-3:Protectionofelectronicdevicesfromelectrostaticphenomena—Propertiesandrequirementsclassificationforpackagingintendedforelectrostaticdischargesensitivedevices
Testmethodsforelectricalmaterials,printedboardsandotherinterconnectionstructuresandassemblies—Part5-4:Generaltestmethodsformaterialsandassemblies—Solderalloysandfluxedandnon-fluxedsolidwireforprintedboardassemblies
Measurementproceduresoflowfrequencymagneticfieldlevelsgeneratedbyelectronicandelectricalequipmentintheelectricvehicleandelectricvehiclesupplyequipmentwithrespecttohumanexposure
Electrostatics—Part5-5:Protectionofelectronicdevicesfromelectrostaticphenomena—Packagingsystemsusedinelectronicmanufacturing
Testmethodsforelectricalmaterials,printedboardsandotherinterconnectionstructuresandassemblies—Part2-719:Testmethodsformaterialsforinterconnectionstructures—Relativepermittivityandlosstangent(500MHzto10GHz)
Testmethodsforelectricalmaterials,printedboardsandotherinterconnectionstructuresandassemblies—Part5-2:Generaltestmethodsformaterialsandassemblies—Solderingfluxforprintedboardassemblies
Nanotechnologies.Performanceevaluationofnanosuspensionscontainingclaynanoplatesforquorumquenching
Spaceproductassurance.Processingandqualityassurancerequirementsforhardbrazingofmetallicmaterialsforflighthardware